Categories

Key Features

• Fanless & Rugged Design
• 6th Gen Intel Core i3/i5/i7 CPU
• Intel Q170 Chipset
• 32GB Memory Supported
• Multi Display Output
• PCIe / Mini PCIe Expansion
• -20°C ~ 60°C Operating Temp

Downloads


Quick Overview

ROC249A is driven by the latest 6th generation Intel Core i3/i5/i7 (Skylake) CPU supporting outstanding CPU & graphics performance with optional support for up to 9 independent display output, 16.8V ~ 31.2V DC power input & extended operating temperature (-20°C ~ 60°C)


Price

Please email or call 01527 512400 for a quote

Product Code

ROC249A

CPU

6th Generation Intel Core i3/i5/i7 Skylake CPU
CPU Socket Supported: LGA1151
TDP: Up to 65W

Chipset

Intel Q170 / H110 Chipset

Memory

2 x 256 Pin 2133MHz DDR4 ECC SO-DIMM Memory Slots
Max Memory Supported: 32GB

Storage

2 x 2.5″ SSD/HDD Drive Bays
1 x M.2 (NGFF) B+M Key Slot

I/O Interface

1 x HDMI 1.4b
2 x DisplayPort
2 x Gigabit Ethernet
2 x Serial RS-232
1 x Serial RS-232/422/485
4 x USB 3.0
2 x Audio (Mic In / Line Out)
1 x 4P Rugged Terminal Connector
1 x Power Button

Expansion

1 x Full Size mPCIe Slot
1 x SIM Card Holder
1 x M.2 (NGFF) B+M Key Slot
1 x PCI Express x16 Slot

Power

16.8V ~ 31.2V DC Input
AT / ATX Mode Select by Jumper

Dimensions (W x D x H)

440mm x 400mm x 44mm

Operating Temperature

-20°C ~ 60°C

Cooling

Natural Passive Convection / Conduction. (No Moving Parts)

O/S Support

Windows 7 Professional (32 / 64Bit)
Windows 8 Professional (32 / 64Bit)
Ubuntu13.04
Ubuntu13.10
Ubuntu14.04
Fedora 20

MIL-STD-810G Test

Method 507.5, Procedure II (Temperature & Humidity)
Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock)
Method 516.6 Shock-Procedure I Operating (Mechanical Shock)
Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration)
Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration)
Method 501.5, Procedure I (Storage/High Temperature)
Method 501.5, Procedure II (Operation/High Temperature)
Method 502.5, Procedure I (Storage/Low Temperature)
Method 502.5, Procedure II (Operation/Low Temperature)
Method 503.5, Procedure I (Temperature shock)

EMC

CE & FCC Compliance