COM Express Compact Size Type 6 Module With AMD Ryzen™ Embedded V2000 APU.
- AMD Ryzen™ V2000 APU.
- Up to 64GB DDR4 Memory.
- Up to 4 x 4K Display (DP / eDP).
- 2.5GbE Ethernet.
- Up to 16 PCIe Gen3 Lanes.
- Configurable TDP (10W).
The ADLINK cExpress-AR, featuring the new AMD Ryzen™ V2000 APU with its high performance integrated Radeon™ graphics, is the first Type 6 module on the market to support an octa-core (8-core) embedded SoC, with up to 16 threads and an impressive turbo boost up to 4.2 GHz.
Compared to earlier embedded quad-core V1000 processors, the additional cores combined with AMD’s Zen 2 architecture result in a more than two-fold performance increase and double the performance-per-watt efficiency.
- Processor
-
New AMD Ryzen™ Embedded V2000 APU (7nm process):
AMD V2748 (2.9 GHz to 4.25 GHz / 4MB L2 Cache / 35W to 54W TDP / 8 Cores / 7 GPU CU).
AMD V2546 (3.0 GHz to 3.95 GHz / 3MB L2 Cache / 35W to 54W TDP / 6Â Cores / 6 GPU CU).
AMD V2718 (1.7 GHz to 4.15 GHz / 4MB L2 Cache / 10W to 25W TDP / 8 Cores / 7 GPU CU).
AMD V2516 (2.1 GHz to 3.95 GHz / 3MB L2 Cache / 10W to 25W TDP / 6 Cores / 6 GPU CU).
- Chipset
-
SoC.
- Memory
-
Dual channel up to 3200 MT/s ECC/non-ECC DDR4 memory.
Up to 64GB in two SODIMM sockets.
ECC / Non-ECC support.
- Storage
-
SATA:
2 x SATA 6Gb/s (SATA 0/1).
- Graphics
-
GPU Feature Support:
AMD Radeon™ Vega Graphics, supporting 4 independent and simultaneous display combinations of DisplayPort/HDMI/LVDS, eDP or VGA outputs (4 x 4K at DP / eDP).
Hardware encode/decode (Including HEVC 10-bit).
DirectX 12 support.
OpenGL 4.6 and ES 3.X support.
OpenCL 2.1 support.Digital Display Interface:
DDI1/2/3 (Supporting DisplayPort 1.4 / HDMI 2.1 / DVI).
DisplayPort 1.4 (Max resolution 4096 x 2160 @ 60Hz).
HDMI 2.1 (Max resolution 4096 x 2160 @ 60Hz) (Max resolution support dependent on carrier).VGA:
Supported by build option through DP-to-VGA IC (In place of DDI3) (Max resolultion 1920 x 1200 @ 60Hz).LVDS
Single/dual channel (18/24-bit) LVDS from eDP-to-LVDS IC (Max resolution 1920 x 1200 @ 60Hz in dual mode).eDP:
Optional 4 lane eDP1.3 support, in place of LVDS (Max resolution 4096 x 2160 @ 60Hz) (Max resolution dependent on carrier).
- I/O
-
USB:
4 x USB 3.2/2.0/1.1 (USB 0,1,2,3) and 4 x USB 2.0/1.1 (USB 4,5,6,7).Serial:
2 x UART ports with console redirection.GPIO:
4 x GPO and 4 x GPI from EC (GPI with interrupt TBC).
- Expansion
-
6 x PCIe x1 (Gen3) Lanes 0/1/2/3 (Configurable to x1, x2, x4) and Lanes 4/5 (x1, x2).
Note: PCIe switch by build option for additional x1 on Lanes 6/7.
1 x PCIe x8 (Gen3) Lanes 16-23 (Configurable to 1 x8, 2 x4).
LPC bus, SMBus (System).
I2C (User).
- Other Features
-
Embedded BIOS:
AMI UEFI with CMOS backup in 32 or 16MB SPI BIOS (Dual BIOS by build option).Cache:
4MB L2 for V2748/V2718, 3MB L2 for V2546/V2516.Audio:
AMD Audio coprocessor integrated in APU (Chipset).
On carrier Express-BASE6 (ALC886 standard support) (Audio Codec).Ethernet:
Intel® Ethernet Controller i225 Series (V/IT versions) (LAN Controller).
2.5Gbit/s, 1000/100/10 Mbit/s Ethernet connection (Interface).Super I/O:
Supported on carrier if needed (Standard support for W83627DHG-P) (Other Super I/O supported by project basis).TPM:
Infineon (Chipset).
TPM 2.0 (LPC based) (Build option).SEMA Board Controller:
Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose I2C, watchdog timer, fan control and failsafe BIOS (Dual BIOS by build option).Debug Headers:
30-pin multipurpose flat cable connector for use with DB-30 x86 debug module providing BIOS POST code LED, EC access, SPI BIOS flashing, power test points, debug LEDs.
- Power
-
Standard Input:
ATX (12V±5% / 5Vsb ±5%) or AT (12V±5%).Wide Input:
ATX (8.5-20 V / 5Vsb ±5%) or AT (8.5-20V).
ACPI 5.0 compliant, Smart Battery support (Management).
Power States (S0, S3, S4, S5 , S5 ECO mode) (Wake on USB S3/S4, WOL S3/S4/S5)
ECO mode (Support deep S5 mode for power saving).
- Environmental
-
Operating Temperature:
0°C to 60°C (Standard).
-45°C to 85°C (Optional Extreme Rugged).Storage Temperature:
-20°C to 80°C (Standard).
-40°C to 85°C (Extreme / TBC).Humidity:
5-90% RH (Operating / Non-condensing).
5-95% RH (Storage & operating with conformal coating).Shock and Vibration:
IEC 60068-2-64 and IEC-60068-2-27.
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D.HALT:
Thermal Stress, Vibration Stress, Thermal Shock and Combined Test.
- OS Support
-
Windows 10 IoT Enterprise (64-bit).
Windows 10 (64-bit).
Ubuntu 20.04 (Planning).
- Dimensions
-
95 mm x 95 mm (Compact size).
Form Factor:
PICMG COM.0: Rev 3.0 Type 6.
- Certification
-
CE.
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- Up to 4 GB DDR3L 1333 MHz Memory.
- One DDI channel, one LVDS (optional eDP)
COM Express® Compact Size Type 6 Module with Intel Atom® E3800 series or Celeron® Processor SoC
- Intel Atom® SoC or Celeron® Processor.
- Up to 8 GB DDR3L 1333 MHz Memory.
- Single/dual channel 18/24-bit LVDS from eDP (two lanes)
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- Intel Atom® SoC or Celeron® Processor.
- Up to 8 GB DDR3L 1333 MHz Memory.
- Single/dual channel 18/24-bit LVDS from eDP (two lanes)