COM Express Type 6 Module With 6th Generation Intel Atom® Processor SoC
- 6th Gen Intel Atom® SoC.
- Up to 32GB DDR4 Memory.
- 6 x PCIe Gen3 Lanes.
- Intel® TCC (Up to 2.5GbE).
- Real Time I/O (GPIO / UART / I2C).
- -40°C to 85°C Extreme Operating Temperature.
The ADLINK cExpress-EL module harnesses the power of 6th generation Intel Atom® x6000 processors, seamlessly integrated with Intel® UHD graphics, operating within a low power envelope and featuring high-speed interfaces.
Supporting In-Band ECC dual-channel DDR4 memory with a capacity of up to 32GB, these modules are available in a rugged operating temperature range and designed for a low power envelope.
This makes them an ideal choice for mission-critical fanless edge computing applications that demand unwavering safety and reliability at all times.
- Processor
-
6th Gen Intel Atom® Processor (Formerly “Elkhart Lake”):
Intel Atom® x6425E (2.0 GHz to 3.0 GHz / 12W TDP / 4 Cores / 32 Execution Units).
Intel Atom® x6413E (1.5 GHz to 3.0 GHz / 9W TDP / 4 Cores / 16 Execution Units).
Intel Atom® x6211E (1.3 GHz to 3.0 GHz / 6W TDP / 2 Cores / 16 Execution Units).
Intel Atom® x6425RE (1.9 GHz / 12W TDP / 4 Cores / 32 Execution Units).
Intel Atom® x6414RE (1.5 GHz / 9W TDP / 4 Cores / 16 Execution Units).
Intel Atom® x6212RE (1.2 GHz / 6W TDP / 2 Cores / 16 Execution Units).
Intel Atom® x6200FE (1.0 GHz / 4.5W TDP / 2 Cores / No GPU).
Intel® Pentium® J6426 (2.0 GHz to 3.0 GHz / 10W TDP / 4 Cores / 32 Execution Units).
Intel® Celeron® J6413 (1.8 GHz to 3.0 GHz / 10W TDP / 4 Cores / 16 Execution Units).
Intel® Pentium® N6415 (1.2 GHz to 3.0 GHz / 6.5W TDP / 4 Cores / 16 Execution Units).
Intel® Celeron® N6211 (1.2 GHz to 3.0 GHz / 6.5W TDP / 2 Cores / 16 Execution Units).
- Chipset
-
SoC.
- Memory
-
Dual channel DDR4 memory up to 3200 MT/s IBECC/non-ECC (32GB Max).
2 x SODIMM sockets (2 x 16GB).
Intel In-Band ECC (IBECC), provides ECC protection with normal type SO-DIMM memory (On Intel Atom® SKUs only, BIOS configurable).
- Storage
-
eMMC:
eMMC 5.0 (16/32/64GB by build option), functions as boot-up device on Windows 10 Enterprise and Yocto Linux.SATA:
2 x SATA 6Gb/s (SATA 0/1).
- Graphics
-
GPU Feature Support:
Intel® Gen11 LP Graphics Core Architecture, supporting 3 independent and simultaneous display combinations of DisplayPort/HDMI/LVDS, eDP or VGA outputs (3 x 4K60).
Hardware encode/transcode of HD content (Including HEVC).
DirectX 12 support and Vulkan v1.1 support.
OpenGL 4.5 and ES 3.2 support.
OpenCL 1.2 support.Digital Display Interface:
DDI1/2 supporting DisplayPort/HDMI/DVI.VGA:
Support by build option via DP-to-VGA IC (In place of DDI2) (Max resolution is 1920 x 1200 @ 60Hz).LVDS:
Single/dual channel (18/24-bit) LVDS via eDP-to-LVDS IC (Max resolution 1920 x 1200 @ 60Hz in dual mode).eDP:
Optional 4 lane support, in place of LVDS (Max resolution is 4096 x 2160 @ 60Hz).
- I/O
-
USB:
2 x USB 3.2/2.0/1.1 (USB 0/1) (Max 10Gbps) and 6 x USB 2.0/1.1 (USB 2-7).
USB Hub supported by project basis provides 4 x USB 3.2/2.0/1.1 (USB 0-3) and 4 x USB 2.0/1.1 (USB 4-7).Serial:
2 x UART ports with console redirection.GPIO/SD:
4 x GPO and 4 x GPI from EC (GPI with interrupt TBC).
SD/GPIO muxed design, switched by BIOS setting, SD functions as storage device only on Windows (Support on Yocto Linux is TBC).
- Expansion
-
6 PCIe x1 Gen3 (AB): Lanes 0/1/2/3
(configurable to 4 x1, 2 x2, 1 x4, 2 x1+1 x2, 1 x2+2 x1),
Lanes 4/5 (only 2 x1 on Lane 4/5)
LPC bus (via ESPI-to-LPC bridge IC), SMBus (system) , I2C (user)
Note: I2C can be managed by ARM M7 processor or x86 processor by BIOS setting. I2C managed by ARM M7 core is for real-time usage (TBC)
Requires HW build option, by project basis.
- Other Features
-
Super I/O:
Supported on carrier if needed (Standard support for W83627DHG-P) (Other Super I/O support is by project basis).TPM (Build option):
Infineon (Chipset).
TPM 2.0 (SPI based).Audio:
Intel® HD Audio integrated in SoC (Chipset).
On Express-BASE6 carrier (ALC886 standard support) (Audio Codec).Ethernet:
Onboard Intel SoC (MAC).
MaxLinear GPY series (PHY).
1000/100/10 Mbit/s or 2.5Gbit/s Ethernet connection (Interface).
GbE0_SDP available if TSN support enabled.
Note: TSN support on Yocto Linux with selected GPY and CPU SKUs.
- Power
-
Standard Input:
ATX: 12V±5% / 5Vsb ±5%; or AT: 12V±5%.Wide Input:
ATX: 8.5-20 V / 5Vsb ±5%; or AT: 8.5-20V.Management:
ACPI 5.0 compliant, Smart Battery support.Power States:
C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5).ECO Mode:
Support deep S5 mode for power saving.
- Environmental
-
Operating Temperature:
0°C to 60°C Standard.
-40°C to +85°C Extreme Rugged (Optional / Selected SKUs).Storage Temperature:
-20°C to 80°C Standard.
-45°C to +85°C Extreme RuggedHumidity:
5-90% RH Operating (Non-condensing).
5-95% RH Storage and operating with conformal coating.Shock and Vibration:
IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition DHALT:
Thermal Stress, Vibration Stress, Thermal Shock and Combined Test.
- OS Support
-
Windows 10 IoT Enterprise (64-bit).
Yocto Linux (64-bit).
VxWorks (64-bit) (TBC).
Ubuntun (TBC).
- Dimensions
-
Form Factor:
PICMG COM.0 Rev 3.0 (Type 6).Dimensions:
95 mm x 95 mm (Compact size).
- Certification
-
CE.
COM Express Mini Size Type 10 Module with Intel Atom® E3800 series SoC or Celeron Processors (formerly Bay Trail)
- Intel Atom® SoC or Celeron® Processor.
- Up to 4 GB DDR3L 1333 MHz Memory.
- One DDI channel, one LVDS (optional eDP)
COM Express® Compact Size Type 6 Module with Intel Atom® E3800 series or Celeron® Processor SoC
- Intel Atom® SoC or Celeron® Processor.
- Up to 8 GB DDR3L 1333 MHz Memory.
- Single/dual channel 18/24-bit LVDS from eDP (two lanes)
COM Express Compact Size Type 2 Module with Intel® Atom™ E3800 series or Celeron® Processor SoC
- Intel Atom® SoC or Celeron® Processor.
- Up to 8 GB DDR3L 1333 MHz Memory.
- Single/dual channel 18/24-bit LVDS from eDP (two lanes)