COM Express Type 6 Module With 13th Gen Intel® Core™ Series CPU.
- COM Express Rev. 3.1.
- 13th Gen Intel® Core™ CPU.
- Up to 64GB DDR5 4800 MT/s.
- AI inferencing (AVX-512 VNNI, Intel® Iris® Xe).
- PCIe Gen4, 4 x displays / 2 x USB4.
- -40°C to 85°C Extreme Operating Temperature.
ADLINK’s Express-RLP COM Express Type 6 Basic size module is based on 13th Gen Intel® Core™ mobile processor (formerly codenamed Raptor Lake-P) and is the first COM Express utilizing Intel’s advanced hybrid architecture (with up to 6 Performance-cores and 8 Efficient-cores) offered with industrial-grade/real-time option to provide superior performance for edge IoT innovations across varied power ranges — at 15W/28W/45W TDP.
- Processor
-
13th Gen Intel® Core™ mobile processors (Formerly Raptor Lake-P):
Cache:
Core™ i7-13800H 24MB (R)E / i7-1370P(R)E: 24MB
Core™ i5-13600H(R)E / i5-1250PRE: 18MB
Core™ i7-1365PE / i7-1365URE / i5-1350PE / i5-1340PE /
i5-1345U(R)E / i5-1335UE /i3-13300H(R)E / i3-1320P(R)E: 12MB
Core™ i3-1315URE: 10MB.
- Chipset
-
SoC.
- Memory
-
Up to 64GB (2 x 32GB) DDR5, IBECC (Selected SKUs), SO-DIMM memory, max.
4800MT/s
2 memory channels with 1DPC design
- Storage
-
On-board Storage: NVMe SSD in place of PCIe lanes 28-31 (build option, project basis)
- Graphics
-
GPU Feature Support:
Intel® Iris Xe or UHD Graphics Core Architecture, max. 96EUs, supporting 4 concurrent display combinations of DisplayPort/HDMI/LVDS/eDP/VGA and Display alternative mode through USB4/Thunderbolt4 outputs 1x 8K30 or 4x 4K60.Hardware video encode/decode, up to 8K60 HEVC.
DirectX 12, OpenGL 4.6, Vulkan 1.2, Mesa 3D support.
OneVPL.
HDCP 2.3.
Graphics Hardware Virtualization (SRIOV).Digital Display Interface:
DDI 1/2/3 supporting DP 1.4a, HDMI 2.1, DVIVGA:
Supported by build option via DP-to-VGA IC (in place of DDI 3), max. resolution 1920 x 1200 @ 60Hz.LVDS:
Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC, max. resolution 1920×1200@60Hz in dual mode.eDP:
Build option in place of LVDS, 4 lanes, eDP 1.4b.USB4:
Max. 2x USB4 in place of DDI 1/2, supports DP 1.4a by DP alternative mode, Thunderbolt 4 capable (TBC).
Requires BIOS code modification by project basis, re-timer with PD on carrier.
- I/O
-
USB:
4 x USB 3.2/2.0/1.1 (USB 0-3), 4 x USB 2.0/1.1 (USB 4-7).
2 x SATA 6Gb/s (SATA 0-1).
Max. two USB4 (In place of DDI 1/2) by project basis, Thunderbolt 4 capable (TBC).Serial:
2x UART ports with console redirection.GPIO:
8 x GPIO (GPI with interrupt).Super I/O:
Supported on carrier if needed (Standard support W83627DHG-P, other Super I/O supported by project basis).Ethernet:
Intel® MAC/PHY: Interface Intel® Ethernet Connection I226 series (I226-IT supports TSN by build option).
Interface: 2.5GbE and 1000/100/10 Mbit/s Ethernet connection GbE0_SDP if TSN support enabled (TBC).
- Expansion
-
PCIe x8 Gen4, lanes 16-23, available for 45W(35W cTDP SKUs)
PCIe x4 Gen4, lanes 24-27
PCIe x4 Gen4, lanes 28-318 PCIe x1 Gen3: Lanes 0/1/2/3 (configurable to x1, x2, x4) and 4 PCIe x1
Gen3: Lanes 4/5/6/7
LPC bus (via ESPI-to-LPC bridge IC), SMBus (system), I2C (user), GP_SPI(TBC)
- Other Features
-
Embedded BIOS:
AMI UEFI with CMOS backup in 32 SPI BIOS (Dual BIOS opt.).SEMA Board Controller Supports:
Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, general purpose I2C, UART, GPIO, watchdog timer, fan control.Debug Headers:
30-pin multipurpose flat cable connector for use with DB30-x86 debug module providing BIOS POST code LED, SEMA Board Controller access, SPI BIOS flashing, power test points, debug LEDs.Audio:
Integrated on SoC (Chipset).
On carrier Express-BASE6 R3.1 (ALC888 standard support Codec).TPM:
Infineon TPM 2.0 (SPI based).
- Power
-
Standard Input:
ATX: 12V±5% / 5Vsb ±5%; or AT: 12V±5%.Wide Input:
ATX: 8.5-20V / 5Vsb ±5%; or AT: 8.5-20V.Management:
ACPI 5.0 compliant, Smart Battery support (TBC).Power States:
C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5) (TBC).ECO Mode:
Supports deep S5 mode for power saving.
- Environmental
-
Operating Temperature:
Standard: 0°C to 60°C (storage: -20°C to 80°C).
Extreme Rugged: -40°C to 85°C (storage: -40°C to 85°C, TBC, build option, selected SKUs).Humidity:
5-90% RH operating, non-condensing.
5-95% RH storage (and operating with conformal coating).Shock and Vibration:
IEC 60068-2-64 and IEC-60068-2-27.
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D (TBC).HALT:
Thermal Stress, Vibration Stress, Thermal Shock and Combined Test.
- OS Support
-
Windows 10 IoT Enterprise LTSC.
Ubuntu 64-bit, Yocto project-based Linux 64-bit (TBC).
VxWorks (TBC).
- Dimensions
-
PICMG COM.0: Rev 3.1 Type 6 (125 mm x 95 mm).
- Certification
COM Express Mini Size Type 10 Module with Intel Atom® E3800 series SoC or Celeron Processors (formerly Bay Trail)
- Intel Atom® SoC or Celeron® Processor.
- Up to 4 GB DDR3L 1333 MHz Memory.
- One DDI channel, one LVDS (optional eDP)
COM Express® Compact Size Type 6 Module with Intel Atom® E3800 series or Celeron® Processor SoC
- Intel Atom® SoC or Celeron® Processor.
- Up to 8 GB DDR3L 1333 MHz Memory.
- Single/dual channel 18/24-bit LVDS from eDP (two lanes)
COM Express Compact Size Type 2 Module with Intel® Atom™ E3800 series or Celeron® Processor SoC
- Intel Atom® SoC or Celeron® Processor.
- Up to 8 GB DDR3L 1333 MHz Memory.
- Single/dual channel 18/24-bit LVDS from eDP (two lanes)