PICMG COM R3.0 Type 6 Module With 11th Gen Intel® Xeon® / Core™ / Celeron® CPU
- 11th Gen Intel® Rocket Lake CPU.
- Up to 96 GB DDR4 Memory.
- Intel® UHD Graphics (Gen 12).
- Flexible I/O Support.
- 9V to 19V Wide Voltage Input.
- 0°C to 60°C Operating Temperature.
Driven by the 11th Gen Intel Xeon/Core/Celeron processor, the Avalue ESM-TGH COM Express Type 6 Module boasts powerful performance.
With a maximum memory capacity of 32GB, the ESM-TGH is equipped with 1x LAN port and an impressive array of 12x USB ports, ensuring seamless connectivity.
Additionally, it caters to diverse application needs, making it an ideal choice for versatile computing environments.
- Processor
-
Mobile 11th Generation Intel® Xeon® Core™ & Celeron® Processors (10nm processer):
Xeon® W-11865MRE (45W / 35W cTDP) (8 Core / 16 Thread) (ECC).
Xeon® W-11155MRE (45W / 35W cTDP) (4 Cores / 8 Threads) (ECC).
Core™ i7-11850HE (45W / 35W cTDP) (8 Cores / 16 Threads) (Non-ECC).
Core™ i5-11500HE (45W / 35W cTDP) (6 Cores / 12 Threads) (Non-ECC).
Core™ i3-11100HE (45W / 35W cTDP) (4 Cores / 8 Threads) (Non-ECC).
Celeron® 6600HE (35W cTDP) (2 Cores / 2 Threads) (Non-ECC).
- Chipset
-
RM590E.
QM580E.
HM570E.
- Memory
-
3 x 260-pin DDR4-3200 SO-DIMM slots.
Each slot supports up to 32 GB (96GB Total).
- Storage
-
4 x SATA3.0 (6.0Gb/s).
- Graphics
-
Chipset:
Gen 12 Intel® UHD Graphics (Xe architecture).Resolution Support:
HDMI 2.0b (4096 x 2304 @ 60Hz).
DP 1.4 (4096 x 2304 @ 60Hz)
LVDS (1920 x 1080 @ 60Hz) (Supports Dual-channel 18/24-bit LVDS) (Via eDP-to-LVDS IC CH7511B).
VGA (1920 x 1200 @ 60Hz) (Via DP to VGA IC Chrontel® 7517A).
eDP 1.4b (4096 x 2304 @ 60Hz / Optional) (Per Intel design guide / need to add Redriver) (Redriver in carrier board to fine tune the signal of DP1.4) (Only support 4 Lanes 2560 x 1440 & 2 Lanes 1920 x 1080).Multiple Display Support:
4 Display support up to 2K (3 x DDI+eDP).
DDI HDMI/DP (Default).
Dual-channel (18/24-bit) LVDS (LVDS via CH7511B).
- I/O
-
USB:
4 x USB 3.2 (Gen.2×1) (10 Gbps).
8 x USB 2.0.DIO:
8 Bit GPIO (NCT5655Y).MIO:
4 x SATAIII (6.0Gb/s).
1 x LPC (Via eSPI to LPC bridge) / I2C / SMBus / 2 x UART (2-wire).HDMI:
HDMI 2.0b.Ethernet:
10/100/1000/2500 Base-TxGbE compatible.
- Expansion
-
1 x Gen4 PCIe x16 (Supports NVMe Storage).
8 x Gen3 PCIe x1.
- Other Features
-
BIOS:
AMI uEFIBIOS, 256 Mbit SPI Flash ROM.Watchdog Timer:
H/W Reset, 1sec. ~ 65535sec. and 1sec./step.H/W Status Monitor:
Monitoring System Temperature, Voltage and FAN Status with Auto Throttling Control.TPM:
TPM2.0.Audio:
Intel HD Audio integrated in SoC.
- Power
-
Requirement:
+9 to +19V.ACPI:
Single power ATX Support (S0, S4, S5 ACPI 5.0a Compliant).Power Mode:
AT/ATX.
- Environmental
-
Operating Temperature:
0°C to 60°C (Standard).
-40°C to 75°C (Industrial) (Build option with selected SKUs).Storage Temperature:
-40°C to 85°C.Operating Humidity:
40°C @ 95% Relative Humidity (Non-condensing).
- OS Support
-
Microsoft® Windows 10 (64-bit).
Linux (Kernel>5.8).
- Dimensions
-
125 x 95 mm.
- Certification
-
FCC (Part 15).
COM Express Mini Size Type 10 Module with Intel Atom® E3800 series SoC or Celeron Processors (formerly Bay Trail)
- Intel Atom® SoC or Celeron® Processor.
- Up to 4 GB DDR3L 1333 MHz Memory.
- One DDI channel, one LVDS (optional eDP)
COM Express® Compact Size Type 6 Module with Intel Atom® E3800 series or Celeron® Processor SoC
- Intel Atom® SoC or Celeron® Processor.
- Up to 8 GB DDR3L 1333 MHz Memory.
- Single/dual channel 18/24-bit LVDS from eDP (two lanes)
COM Express Compact Size Type 2 Module with Intel® Atom™ E3800 series or Celeron® Processor SoC
- Intel Atom® SoC or Celeron® Processor.
- Up to 8 GB DDR3L 1333 MHz Memory.
- Single/dual channel 18/24-bit LVDS from eDP (two lanes)