COM Express Type 6 Module With 11th Gen Intel® Core™ Series CPU.
- 11th Gen Intel® Core™ Series.
- Up to 96GB DDR4 3200MHz.
- DP++ Supports 4K Resolution.
- Rich I/O Interface (USB / SATA / LAN).
- Multiple Expansion (PCIe / SMBus / I2C / UART).
- -40 to 85°C Operating Temperature.
The DFI TGH960 is a compact COM Express Type 6 Module featuring an 11th Gen Intel® Core™ CPU, ideal for embedded applications.
With high-performance processing, integrated graphics, and robust industrial features, it supports DDR4 memory, SATA storage, and versatile I/O interfaces.
Built for reliability in challenging environments, the TGH960 underscores DFI’s commitment to long-term availability and support for embedded systems.
- Processor
-
11th Gen Intel® Core™ Processors (BGA 1787):
Intel® Xeon® W-11865MRE (8 Cores / 24M Cache / 2.6GHz to 4.7GHz / 45W TDP) (RM590E).
Intel® Xeon® W-11865MLE (8 Cores / 24M Cache / 1.5GHz to 4.5GHz / 25W) (RM590E).
Intel® Core™ i7-11850HE (8 Cores / 24M Cache / 2.6GHz to 4.7GHz / 45W) (RM590E/QM580E).
Intel® Xeon® W-11555MRE (6 Cores, 12M Cache, 2.6GHz (4.5GHz), 45W (RM590E).
Intel® Xeon® W-11555MLE (6 Cores, 12M Cache, 1.9GHz (4.4Hz), 25W (RM590E).
Intel® Core™ i5-11500HE (6 Cores, 12M Cache, 2.6GHz (4.5GHz), 45W (RM590E/QM580E)
Intel® Xeon® W-11155MRE, 4 Cores, 8M Cache, 2.4GHz (4.4GHz), 45W (RM590E).
Intel® Xeon® W-11155MLE, 4 Cores, 8M Cache, 1.8GHz (3.1GHz), 25W (RM590E).
Intel® Core™ i3-11100HE, 4 Cores, 8M Cache, 2.4GHz (4.4GHz), 45W (RM590E/QM580E/HM570E)
Intel® Celeron® 6600HE, 2 Cores, 8M Cache, 2.6GHz, 35W (RM590E/QM580E/HM570E)
- Chipset
-
Intel® RM590E/QM580E/HM570E Chipset.
- Memory
-
3 x DDR4 3200MHz SO-DIMM up to 96GB (4th DIMM by request).
Dual Channel DDR4 3200MHz ECC support.
- Storage
-
NVMe SSD (Optional):
PCIe x4 (Gen4) 64GB~1TB Capacity.
SSD and 2nd DDR4 SO-DIMM (DIMM2) is alternative function.
- Graphics
-
Controller:Intel® Iris® Xe Graphics.Feature:OpenGL 4.5, DirectX 12, OpenCL 2.1.
MPEG2, WMV9, AVC/H264, JPEG/MJPEG, HEVC/H265, VP9, AV1 (HW Decode).
AVC/H264, JPEG, HEVC/H265, VP9 (HW Encode).Display:1 x VGA.
1 x LVDS/eDP (eDP available upon request).
3 x DDI (HDMI/DP++).Multiple Displays:VGA + LVDS + 2 DDI or VGA + 3 DDI or LVDS + 3 DDI.
- I/O
-
Ethernet:
1 x Intel® I225 series (10/100/1000Mbps/2.5G).
USB:
4 x USB 3.2 (Gen2).
8 x USB 2.0.DIO:
1 x 8-bit DIO (Default 4 inputs and 4 outputs).
- Expansion
-
1 x PCIe x16 (Gen 4).
8 x PCIe x1 (Gen 3).
1 x LPC.
1 x I2C.
1 x SMBus.
2 x UART (TX/RX).
- Other Features
-
BIOS:
AMI SPI 256Mbit.Audio:
HD Audio.
Watchdog Timer:
System Reset, Programmable via Software from 1 to 255 Seconds.Security:
TPM2.0 (Available Upon Request).
- Power
-
Type:
8.5V~20V, 5VSB, VCC_RTC (ATX mode).
8.5V~20V, VCC_RTC (AT mode).Consumption:
TBD.
- Environmental
-
Temperature:0 to 60°C (Default) / -40 to 85°C (Optional) Operating.
-40 to 85°C Storage.Humidity:5 to 90% RH Operating.
5 to 90% RH Storage.MTBF:TBD.
- OS Support
-
Microsoft:
Windows 10 IoT Enterprise (64-bit).
Linux:Ubuntu 20.04.
- Dimensions
-
COM Express® Basic.
95mm (3.74″) x 125mm (4.9″).Compliance:
PICMG COM Express® R3.0 (Type 6).
- Certification
-
CE / FCC / UKCA / RoHS.
COM Express Mini Size Type 10 Module with Intel Atom® E3800 series SoC or Celeron Processors (formerly Bay Trail)
- Intel Atom® SoC or Celeron® Processor.
- Up to 4 GB DDR3L 1333 MHz Memory.
- One DDI channel, one LVDS (optional eDP)
COM Express® Compact Size Type 6 Module with Intel Atom® E3800 series or Celeron® Processor SoC
- Intel Atom® SoC or Celeron® Processor.
- Up to 8 GB DDR3L 1333 MHz Memory.
- Single/dual channel 18/24-bit LVDS from eDP (two lanes)
COM Express Compact Size Type 2 Module with Intel® Atom™ E3800 series or Celeron® Processor SoC
- Intel Atom® SoC or Celeron® Processor.
- Up to 8 GB DDR3L 1333 MHz Memory.
- Single/dual channel 18/24-bit LVDS from eDP (two lanes)