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Fanless Scalable T2G Onboard Gateway

SKU: AVA-1000
  • EN50155 Compliant T2G Gateway.
  • ARM / x86 CPU Platform.
  • Supports 1GbE M12 Ethernet.
  • Wide DC 24-110V Power Input.
  • Fanless Extended Temperature Support.
  • -40°C to 70°C Operating Temperature.
Datasheet
Drivers & Support
Specifications
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Overview:

  • On Request

5 - 6 Weeks Lead Time

  • View all our regulatory information

Drivers, Documentation & Support

  • Documentation
  • Drivers
  • Need Help?
  • Talk to a solution specialist we're here to make sure you get your right fit solution.

Specifications

  • System
  • Processor(s)

  • ARM:
    NXP i.MX8M Plus with Quad Core NXP i.MX8M-PLUS, NPU, 8GB LPDDR4,
    64GB eMMC (With options).

    Intel:
    7th Gen Intel® Core™ Alder Lake with N50 2-Core CPU, 4GB LPDDR5,
    32GB eMMC (With options).
    Other CPU upon request.
  • Chipset

  • On-board SoC.
  • Graphics / Display
  • Display Ports

  • 1 x HDMI.
  • Graphics Chipset

  • Integrated Intel® UHD Graphics.
  • Memory
  • Memory Type

  • LPDDR4 / LPDDR5.
  • Number of Slots

  • Onboard.
  • Clock Speed

  • 4800MT/s.
  • Max Capacity

  • ARM:
    8GB LPDDR4.

    Intel:
    4GB LPDDR5.
  • I/O
  • Ports

  • Ethernet:
    3 x M12 1Gb X-coded Ethernet ports.

    USB:
    1 x USB 3.1 (Gen1 / Type A) port.

    GPIO:
    2DI/2DO (Extra I/O by options).

    Serial Ports:
    RS-232/RS-422/RS-485.

    I2C:
    By options.

    CAN:
    By options.

    Wireless:
    2 x PCIE Gen3 x1 M.2 B-key- 3042/52 slot with optional 5G module selected.
    1 x PCIE Gen3 x1 M.2 E-key-2230 slot with optional Wifi module selected GNSS embedded.

    Antenna:
    8 x QMA antenna for 5G module (4 per module).
    2 x QMA antenna for WiFi module.
    1 x QMA antenna for GNSS module on carrier board.

    Maintenance Port:
    1 x DIP SW with 2 switch.
    1 x Micro USB console port.
    1 x Micro USB port for OS upgrade.
  • Storage
  • Storage Type

  • NVME:
    1 x PCIE Gen3 x4 M.2 M-key 2242 NVME slot.

    ARM:
    64GB eMMC (With options).

    Intel:
    32GB eMMC (With options).
  • RAID Support

  • N/A.
  • Expansion
  • Slots

  • SD Card:
    1 x Micro SD slot.

    SIM:
    4 x SIM slots (2 per 5G module).
  • Power
  • Input Voltage Range

  • 24VDC to 110VDC (16.8V to 137.5V) according to EN 50155:2021 Sec. 5.2.2.
    Supply voltage interruption class S2.
    Supply change-over class C1.
    Default 100W DC input.
  • Connector Type

  • IEC 61076 M12 A-coded connector.
  • Other Power Features

  • Power Reset Button:
    1 x Power reset button on wall side.

    Ignition:
    Power off delay time option: 60 sec. by default.
    Input protected to same level as power input.

    GND:
    1 x M6 threaded stainless steel thread holes.
    1 x M6 threaded stainless steel thread studs.

    Battery:
    CR2032X coincell battery by default.

    MTBF:
    40,000 hrs (TBD).
  • Environmental
  • Temperature

  • Operating Temperature (OT4):
    -40°C to 70°C (EN50155:2021 OT4 Class, ST1 +15C for 10 mins).

    Storage Temperature:
    -40°C to +85°C.

    Humidity (Operating):
    10% to 95% relative humidity (Non-condensing).

    Humidity (Non-Operating):
    5% to 95% relative humidity (Non-condensing).
  • Shock

  • EN50155:2021 13.4.10 (Ref. to EN 61373:2010 category 1 class B).
  • Vibration

  • EN50155:2021 13.4.10 (Ref. to EN 61373:2010 category 1 class B).
  • IP Rating

  • EN60529 IP40 (TBC).
  • Mechanical
  • Dimensions

  • (L) 229 x (W) 126 x (H) 65 mm.
  • Weight

  • Est. approx. 3 kg.
  • Mounting

  • Wall Mount.
  • Other
  • Additional Features

  • BIOS:
    AMI UEFI with CMOS backup in 32 SPI BIOS (Dual BIOS Optional).

    TPM:
    TPM 2.0 with 2048-bit RSA.

    LED:
    1 x Power (G).
    1 x Storage (Y).
    1 x WDT (Y) on front panel.

    Coating:
    Conformal coating.

    Cooling:
    Fanless design with passive cooling.
    Suggest air convection air flow 0.6m/s.
  • OS Support

  • ARM:
    Debian + ADLINK eGi-Flow.

    X86:
    Linux Ubuntu 22.04 (64-bit).
    Windows.
  • Certification

  • Safety:
    EN50124-1:2017; Insulation coordination PD2.
    EMC EN50155:2021 Clause 13.4.9.
    With reference to EN50121-1:2017; EN50121-3-2:2016.
    EN61000-4-2:2009; EN61000-4-3:2006 + A1:2008 + A2:2010.
    EN61000-4-4:2012; EN61000-4-5:2014 + A1: 2017.
    EN61000-4-6:2014 + AC: 2015.

    Fire Protection:
    EN45545-2:20132+A1:2015 (HL 1-3) EL9 for PCB (R24 / R25) manufactured by ADLINK.
    Note: Adlink is not responsible for EN45545 for 5G modules and Wifi modules.

    Insulation:
    EN50124 Compliance.
    EN50153 Compliance.

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