Industrial Jetson Orin AGX Carrier With 10GbE & Up to 4 x PoE
Key Features:
- 10GbE & Up to 4 x PoE
- -25°C to +80°C Operating Temp
- Wide DC Input
- 2 x Isolated CAN (Inc. CAN FD)
- 5 x GPIO
- Available Until 2032
Overview:
The Aetina AIB-MX11-1-A1 packs serious processing power into a compact platform, making it ideal for demanding edge AI applications.
Featuring the high-performance NVIDIA Jetson AGX Orin 32GB module, it delivers up to 275 TOPS of AI performance, significantly exceeding previous generations.
Back-Order Lead Time:
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Specifications
- System
Module Compatibility:
NVIDIA Jetson AGX Orin 32GB (AIB-MX11 / AIB-MX12).
NVIDIA Jetson AGX Orin 64GB (AIB-MX21 / AIB-MX22).
AI Performance:
200 TOPS (AIB-MX11 / AIB-MX12).
275 TOPS (AIB-MX21 / AIB-MX22).
GPU:
1792-core NVIDIA Ampere GPU (56 Tensor Cores) (AIB-MX11 / AIB-MX12).
2048-core NVIDIA Ampere GPU (64 Tensor Cores) (AIB-MX21 / AIB-MX22).
CPU:
8-core Arm® Cortex® -A78AE v8.2 64-bit CPU 2MB L2 + 4MB L3 (AIB-MX11 / AIB-MX12).
12-core Arm® Cortex® -A78AE v8.2 64-bit CPU 3MB L2 + 6MB L3 (AIB-MX21 / AIB-MX22).
Memory:
32GB 256-bit LPDDR5 204.8 GB/s (AIB-MX11 / AIB-MX12).
64GB 256-bit LPDDR5 204.8 GB/s (AIB-MX21 / AIB-MX22).
Storage:
64GB eMMC 5.1.
Expansion:
1 x M.2 B-Key 3042/3052 (LTE/4G/5G).
1 x M.2 E-Key 2230 (WiFi/BT).
1 x M.2 M-Key 2280 (Supports NVMe) (PCIe x2 Gen3).
1 x microSD Card Slot.
- I/O
Display:
1 x HDMI 2.0 (Type A).
Audio:
Line-out/Line-in/Mic (Optional with daughter board).
Camera Input
1 x 16-Lane MIPI Expansion Connector (120-Pin).
LAN:
1 x RJ-45 GbE port.
1 x RJ-45 10GbE port.
PoE Interface:
2 x RJ-45 GbE PSE (IEEE 802.3af compliant) (Power Output 15W/Port)* (AIB-MX11 / AIB-MX21).
4 x RJ-45 GbE PSE (IEEE 802.3af compliant) (Power Output 15W/Port)* (AIB-MX12 / AIB-MX22).
*PSE Port 1 & Port 2 support IEEE 802.3at compliant; Total PSE ports support up to 60W.
USB:
2 x USB 3.2 (Gen1) (Type A).
1 x OTG (Type-C).
1 x USB 3.2 (Gen2) (Type-C).
Other I/O Interfaces:
2 x UART.
1 x UART (Debug only).
1 x RS-232.
1 x RS-422/485 (2-in-1).
2 x CAN 2.0b (Isolation / Supports CAN FD).
2 x I2C.
1 x I2S.
1 x SPI.
5 x GPIO.
2 x 3.3VDC/0.5A.
3 x 5VDC/0.5A.
1 x 12VDC/0.5A.
1 x USB 2.0.
1 x microSIM Card Slot.
- Power
Power Consumption:
10.5W Idle / 111* W Full Loading (AIB-MX11 / AIB-MX12).
12W Idle / 132* W Full Loading (AIB-MX21 / AIB-MX22).
*For more test condition information, please refer to user manual.
Power Input/Connector:
DC-in 9 to 36 VDC / 4-Pin DC Jack Power Connector.
- Environmental
Operating Temperature:
-25°C to 80°C.
Storage Temperature:
-40°C to 85°C.
Humidity:
95% @ 40°C (Non-condensing).
Vibration:
1 Grms, IEC 60068-2-64, random, 5 ~ 500 Hz, 1 hr/axis.
Shock:
10 G, IEC 60068-2-27, half sine, 11 ms duration.
Certification:
CE / FCC Class A / UKCA.
- Mechanical
Dimension (W x D x H):
176 x 132 x 57.32 mm (6.93 x 5.19 x 2.26 in).
Weight (Net):
0.980 kg (2.161 lb) With Fansink.
- Other Features
Software Support:
Linux (Support Jetpack 5.0 above).
MISC. Function:
1 x Power / Recovery / Reset button.
TPM:
TPM v2.0 (Optional).
RTC:
With super capacitor battery (Optional).
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