Compact Fanless AI Jetson Orin AGX System With 10GbE & 4 x PoE
Key Features:
- 4 x PoE Ports
- 10 Gigabit Ethernet
- Out-of-band Management
- Analogue Audio
- 3 x M.2 Expansion Slots
- Available Until 2032
Overview:
ADLNK DLAP-411-Orin series Edge AI Inference Platform powered by NVIDIA® Jetson AGX Orin™ is a high-performance platform designed for deployment of AI-powered systems at the edge, providing the computing power needed for demanding AI applications.
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Technical Support
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- computers@steatite.co.uk
Specifications
- System
Model:
200 TOPS (DLAP-411-Orin / DLAP-411-Orin w/ PSE / DLAP-411-Orin w/ OOB).
275TOPS (DLAP-411-Orin 64GB / DLAP-411-Orin 64GB w/ PSE / DLAP-411-Orin 64GB w/OOB / DLAP-411-Orin 64GB w/ 10GbE).
GPU:
NVIDIA Ampere Architecture With 1792 NVIDIA® CUDA® Cores (56 Tensor Cores).
NVIDIA Ampere Architecture With 2048 NVIDIA® CUDA® Cores (64 Tensor Cores).
CPU:
8-core Arm® Cortex®-A78AE v8.2 64-bit CPU 2MB L2 + 4MB L
12-core Arm® Cortex®-A78AE v8.2 64-bit CPU 3MB L2 + 6MB L3
Memory:
32GB 256-bit LPDDR5.
64GB 256-bit LPDDR5.
Storage:
64GB eMMC 5.1.
Expansion:
1 x M.2 M key 2242 & 2280 PCIe (Gen4).
1 x M.2 B key 3042 & 3052 for 5G/LTE.
M.2 E key 2230 for Wifi.
1 x MicroSD Slot
Support 10G/5G/2.5G/1000M/100M/10M LAN speed
- I/O
Front I/O Interfaces:
1 x Power / 1 x Reset / 1 x Recovery Buttons.
1 x HDMI (Max Resolution 3840 x 2160 @ 60Hz).
4 x USB 3.2 (Gen2) (Type A).
4 x 10/100/1000Mbps Ethernet (Optional PoE support) (IEEE 802.3af/at).
Mic-in (Mono) / Line-out (Stereo).
2 x D-Sub I/O Connector (26-pin connector) (GPIO / I2C / SPI) provide cable for expansion.
Back I/O Interfaces:
1 x USB 3.2 (Gen2) (Type-C) (OTG).
1 x COM RS-232/RS-422/RS-485 (DB9).
1 x Can Bus Isolated 2.0b (DB9).
- Power
DC Input:
24V.
AC Input:
160 (Up to 220W power adapter).
Power Switch:
1 x Power ON/OFF Button (AT/ATX) (Default: AT).
- Environmental
Operating Temperature (32GB Models):
-20°C to 60°C with 0.6m/s airflow at 40W (Without wifi module) (M.2 SSD).
-20°C to 55°C with 0.6m/s airflow at MAXN (Without wifi module) (M.2 SSD).
Operating Temperature (64GB Models):
-20°C to 55°C with 0.6m/s airflow at 50W (Without wifi module) (M.2 SSD).
-20°C to 40°C with 0.6m/s airflow at MAXN (Without wifi module) (M.2 SSD).
Operating Temperature (64GB With 10GbE Models):
0°C to 55°C with 0.6m/s airflow at 50W (Without wifi module) (M.2 SSD).
Storage Temperature:
-40°C to +85°C.
Humidity:
~95% @ 40°C (Non-condensing) (Optional with fanless solution).
Vibration:
Operating 5Grms | 5-500Hz | 3 axes w/M.2 SSD.
Shock:
Operating 100G | Half sine 11ms duration w/ SD | M.2 SSD
ESD:
Contact ± 4kV, Air ± 8kV.
Regularity:
CE & FCC Class B (EN61000-6-4/-6-2) / CE-LVD & UL by CB / FCCID.
- Mechanical
Dimensions (W x D x H):
175 x 145 x 85 mm.
Weight:
2.2 kg.
Mounting:
Wall Mount.
VESA DIN Rail (Optional).
- Other Features
Operating System Support:
Linux® Ubuntu.
WDT:
WDT Supported.
Thermal Sensor:
1 x Thermal Sensor.
SMA Antenna Connector:
6.
LED:
6 x User defined LEDs.
Out-Of-Band (OOB):
Support Ethernet and Wifi, monitoring and managing at remote locations (Thermal sensor, remote power on/off, restart, monitor debug port detection device status).
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