Compact Industrial Jetson Orin AGX Carrier With 10GbE
- In Stock
Key Features:
- 10 Gigabit Ethernet
- -25°C to +80°C Operating Temp
- Wide DC Input
- 2 x Isolated CAN (Inc. CAN FD)
- 5 x GPIO
- Available Until 2032
Overview:
NVIDIA Jetson AGX Orin module offers up to 275 TOPS, 8 times more than NVIDIA® Jetson AGX Xavier™ 32GB module. Built in up to 2048 NVIDIA® CUDA® cores and 64 Tensor Cores, NVIDIA Jetson AGX Orin module enables server-class AI inference at the edge with low latency.
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Specifications
- System
Module Compatibility:
NVIDIA Jetson AGX ORIN 32GB (AIB-MX13).
NVIDIA Jetson AGX ORIN 64GB (AIB-MX23).
AI Performance:
200 TOPS (AIB-MX13).
275 TOPS (AIB-MX23).
GPU:
1792-core NVIDIA Ampere GPU (56 Tensor Cores) (AIB-MX13).
2048-core NVIDIA Ampere GPU (64 Tensor Cores) (AIB-MX23).
CPU:
8-core Arm® Cortex®-A78AE v 8.2 64-bit CPU 2MB L2 + 4MB L3 (AIB-MX13).
12-core Arm® Cortex®-A78AE v 8.2 64-bit CPU 3MB L2 + 6MB L3 (AIB-MX23).
Memory:
32 GB 256-bit LPDDR5 204.8 GB/s (AIB-MX13).
64GB 256-bit LPDDR5 204.8 GB/s (AIB-MX23).
Storage:
64GB eMMC 5.1.
Expansion:
1 x M.2 B-Key 3042/3052 (LTE/4G/5G).
1 x M.2 E-Key 2230 (WiFi/BT).
1 x M.2 M-Key 2280 (Supports NVMe) (PCIe x4 Gen4).
1 x microSD Card Slot.
- I/O
Display:
1 x HDMI 2.0 (Type A).
Audio:
Line-out/Line-in/Mic (Optional with daughter board).
Camera Input:
1 x 16-Lane MIPI Expansion Connector.
LAN:
1 x RJ-45 GbE port.
1 x RJ-45 10GbE port.
USB:
2 x USB 3.2 (Gen1) (Type A).
1 x OTG (Type-C).
1 x USB 3.2 (Gen2) (Type-C).
Other I/O Interfaces:
2 x I2C.
1 x I2S.
1 x SPI.
5 x GPIO.
1 x 3.3VDC/0.5A.
2 x 5VDC/0.5A.
1 x 12VDC/0.5A.
1 x USB 2.0.
2 x UART.
1 x UART (Debug only).
1 x RS-232.
1 x RS-422/485 (2-in-1).
2 x CAN 2.0b (Isolation) (Support CAN FD).
- Power
Power Consumption:
6.655 W Idle / 52.25* W Full Loading (AIB-MX13).
6.9 W Idle / 72.25* W Full Loading (AIB-MX23).
*For more test condition information, please refer to user manual.
Power Input/Connector:
DC-in 9 to 36 VDC / 4-pin DC Jack Power Connector.
- Environmental
Operating Temperature:
-25°C ~ +80°C (-13°F ~ +176°F).
Storage Temperature:
-40°C ~ +85°C (-40°F ~ +185°F).
Humidity:
95% @ 40°C (104°F) (Non-condensing).
Vibration:
1 Grms, IEC 60068-2-64, random, 5 ~ 500 Hz, 1 hr/axis.
Shock:
10 G, IEC 60068-2-27, half sine, 11 ms duration.
Certification:
CE / FCC Class A / UKCA.
- Mechanical
Dimension (W x D x H):
131 x 120 x 62.9 mm (5.16 x 4.72 x 2.47 in).
Weight (Net):
0.701 kg (1.54 lb) With Fansink.
- Other Features
Software Support:
Linux (Support Jetpack 5.0 above).
TPM:
TPM v2.0 (Optional).
RTC:
With super capacitor battery (Optional).
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