Military Grade Convection Cooled Computer With 7th Gen Xeon CPU & Nvidia GPU
Key Features
- Supports NVIDIA Graphics.
- MIL-STD-810G Shock/Vibration.
- MIL-STD-461F For EMC.
- IP67 All Round Protection.
- -40 to +75°C Operating Temperature.
- 3 x Display, 4x LAN, 7x COM.
Overview
Inside the ADLINK HPERC-KBL-MH you will find the powerful 7th generation Intel® Xeon® E3-1505M v6 processor, 16GB DDR4 soldered memory and support for Windows® & Linux operating systems.
Pricing Available Upon Request
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Specifications
System
Processor(s):
Intel® Xeon® Processor E3-1505M v6 (Quad Core).
Chipset:
Intel® CM238 Chipset.
Graphics Chipset (Optional):
NVIDIA Quadro P1000 MXM card with 4GB GDDR5.
NVIDIA Quadro T1000 MXM card with 4GB GDDR6.
Memory:
16GB 2400 MHz DDR4 ECC Soldered Down.
Storage:
2 x 2.5” SLC/MLC SSD on SATA 6 Gb/s.
1 x SDHC – SLC (Up to 32 GB).
RAID:
RAID 0/1 (Intel RST).
Expansion:
MXM (PCIe x16 Gen3).
PCI/104 Express Type 2 (PCIe Gen2).
PCI Express Mini Card (PCIe Gen2).
I/O
I/O Connectors:
MIL-DTL-38999 (Uniquely-Keyed).
Display:
2 x DVI.
1 x VGA.
3 Simultaneous Display Outputs.
Audio:
1 x Amplified Stereo Output.
1 x Stereo Input.
Ethernet:
4 x Intel® I210 Ethernet Controller (10/100/1000 Mbps).
USB:
6 x USB 2.0.
Serial:
7 x RS-232/422.
GPIO:
8 x Digital IO.
Power
Input Voltage Range:
18 – 36VDC.
Connector Type:
MIL-DTL-38999 (Uniquely-keyed).
Other Power Features:
Performance (S-States S3, S4).
Environmental
Operating Temperature (CPU Only):
-40°C to +75°C Ambient*.
MIL-STD-810G (501.5 Procedure II).
MIL-STD-810G (502.5, Procedure 1 and 2).
Operating Temperature (With EGX-MXM-P1000):
-40°C to +70°C Ambient (With 30 CFM Airflow).
Operating Temperature (With EGX-MXM-T1000):
-40°C to +69°C Ambient (With 43.6 CFM Airflow).
Storage Temperature:
-40°C to +85°C.
EMI / EMC:
MIL-STD-461F.
Vibration:
MIL-STD-810G – 514.6 Procedure I.
Categories 4, 9, 11, 21.
Shock:
MIL-STD-810G – 516.6 Procedures I and V.
Salt Spray:
RTCA/DO-160G, Section 14, Category S.
Immersion:
IEC60529, IP-67.
Altitude:
0 to 50,000 ft.
Power:
MIL-STD-704F & MIL-STD-1275E.
Mechanical
Dimensions:
(L) 304.8 x (W) 150 x (H) 130 mm (With Mounting Brackets).
Weight:
5.54 kg.
Mounting:
Wall Mount Kit.
DIN-Rail Kit.
Form Factor:
VITA-75.21 Finned Passive Convection.
Other Features
Internal Thermal Transfer:
Top-cover heatsink cooled (Free air convection).
VITA 75.21 mount.
TPM:
Infineon SLB 9665XT2.0.
Secure Erase:
Hardware input triggered.
Software triggered.
Operating System Support:
Windows® 10 (64-bit).
RHEL 7.3.
Documentation & Support
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