COM Express Rev. 3.1 Basic Size Type 7 Module with AMD Ryzen™ Embedded V3000
- AMD Embedded Ryzen V3000 CPU.
- Up to 64GB DDR5 4800 MT/s.
- 2.5G & 10G Ethernet Supported.
- 14 x PCIe Gen4 Lanes.
- Multi I/O & Storage Options.
- -40°C to 85°C Operating Temperature.
ADLINK’s Express-VR7 COM Express Type 7 Basic size module is based on AMD Embedded Ryzen™ V3000 series processor.
Offering up to 8 cores and 16 threads at 15W/45W TDP, the module exhibits the best performance per watt in its class, along with 14x PCIe Gen4 lanes with enterprise level reliability and extreme rugged temperature option (-40°C to 85°C).
- Processor
-
AMD Embedded Ryzen V3000 Processor:
V3C48 3.3/3.8GHz 8 Cores / 16 Threads 45W.
V3C44 3.5/3.8GHz 4 Cores / 8 Threads 45W.
V3C18I 1.9/3.8GHz 8 Cores / 16 Threads 15W.
V3C16 2.0/3.8GHz 6 Cores /12Threads 15W.
V3C14 2.3/3.8GHz 4 Cores / 8 Threads 15W.Note:
Availability of features may vary between processor SKUs. Note: V3C18I could be used for extreme temperature (TBC).
- Chipset
-
Infineon.
- Memory
-
Dual channel up to 4800 MT/s ECC/non-ECC DDR5 memory up to 64GB (2x 32GB)
in two SODIMM sockets
Two SO-DIMM on top side
- Storage
-
2 x SATA 6Gb/s (SATA 0/1).
- Graphics
-
Contact us for more details.
- I/O
-
USB:
4 x USB 3.x/2.0/1.1 (USB 0/1/2/3).Serial:
2 x UART ports with console redirection.GPIO/SD:
4 x GPO and 4 x GPI (GPI with interrupt TBC).
- Expansion
-
All Gen4 speed:
8 PCI Express Gen4: Lanes 16-23 (Configurable to one x8, two x4, two controller).
4 PCI Express Gen4: Lanes 0-3 (Configurable to four x1, two x2, one x4, four controller).
2 PCI Express Gen4: Lanes 4-5 (Configurable to one x1, one x2, one controller).
LPC bus (Through an ESPI to LPC bridge IC), SMBus (System) , I2C (User), GP_SPU (User, project basis).
- Other Features
-
Supported on carrier if needed (Standard support for W83627DHG-P, other Super I/O supported by project basis).
- Power
-
Standard Input ATX: 12V±5% / 5Vsb ±5%; or AT: 12V±5%
Management ACPI 5.0 compliant
Power States C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5)
- Environmental
-
Form Factor: PICMG COM.0: Rev 3.1 Type 7
Operating Temperature: Standard: 0°C to 60°C (Storage: -20°C to 80°C)
Extreme Rugged: -45°C to 85°C (build option, selected SKUs)
(Storage: -40°C to 85°C) (TBC)Humidity: 5-90% RH operating, non-condensing
5-95% RH storage (and operating with conformal coating)
- OS Support
-
Standard Support Yocto Linux, Ubuntu 20.04.3 LTS (TBC)
Extended Support (BSP) Yocto project based Linux
- Dimensions
-
Basic size: 125 mm x 95 mm
- Certification
-
Contact us for more details.
COM Express Type 6 Compact Module With 13th/12th Gen Raptor Lake U / Alder Lake U CPU.
- 13th/12th Gen Intel® CPU.
- Up to 64GB DDR4 3200MHz.
- Up to 12 Lanes PCI Express.
COM Express Compact Size Type 6 Module With AMD Ryzen™ Embedded V2000 APU.
- AMD Ryzen™ V2000 APU.
- Up to 64GB DDR4 Memory.
- Up to 4 x 4K Display (DP / eDP).
COM Express Rev. 3.1 Basic Size Type 7 Module with AMD Ryzen™ Embedded V3000
- AMD Embedded Ryzen V3000 CPU.
- Up to 64GB DDR5 4800 MT/s.
- 2.5G & 10G Ethernet Supported.
