COM Express Compact Size Type 6 Module With Elkhart Lake Intel® Celeron® or Atom™ CPU.
- Elkhart Lake Intel® SoC.
- Up to 32GB DDR4 Memory.
- Triple Display Support.
- Up to 128GB eMMC 5.1 (Optional).
- TPM2.0 Security (Optional).
- eMMC 5.1 up to 128GB (optional)
Empowered by Intel Celeron, Pentium, or Atom processors, the Avalue ESM-EHLC COM Express Type 6 Module delivers robust performance.
With a memory capacity of up to 32GB, this module features 1x LAN port and an impressive array of 12x USB ports, providing comprehensive connectivity.
Additionally, it ensures seamless integration and optimal functionality for a wide range of industrial applications.
- Processor
-
Intel® Celeron® J6413 (4 Core / 1.8 GHz / 10W TDP).
Intel® Celeron® J6412 (4 Core / 1.8 GHz / 10W TDP).
Intel® Atom® x6413E (4 Core / 1.5 GHz / 9W TDP).
Intel® Atom® x6425RE (4 Core / 1.9 GHz / 12W TDP).
- Chipset
-
Elkhart Lake SoC integrated.
- Memory
-
2 x 260-pin SODIMM DDR4 3200 SDRAM slot with supported In-Band ECC memory protection (Selected SKUs).
Up to 32GB Maximum Capacity.
- Storage
-
2 x SATA3.0 (6.0Gb/s).
Up to 128GB eMMC 5.1 (Optional).
- Graphics
-
Intel® Elkhart Lake SoC Processor integrated Gen11 LP graphics.
Supported Resolutions:
HDMI 1.4b/2.0b (4096 x 2160 @ 60Hz).
DP 1.4 (4096 x 2160 @ 60Hz) (*Per Intel design guide, need to add Redriver) (Redriver in carrier board to fine tune the signal of DP1.4).
eDP 1.3b (Optional) (4096 x 2160 @ 60Hz) (Only support 4 Lanes 2560 x 1440 & 2 Lanes 1920 x 1080).
LVDS (Via eDP-to-LVDS) (1920 x 1080 @ 60Hz) (LVDS via CH7511B).
VGA (Via DP-to-VGA) (1920 x 1080 @ 60Hz) (VGA via CH7517A) (DP to VGA).LVDS CH7511B (eDP to LVDS)
DDI HDMI
DP
DisplayPort
- I/O
-
USB:
8 x USB 2.0.
4 x USB 3.2 Gen2x1 (10 Gbps).Serial (COM):
2 x COM Ports (RX/TX only).DIO:
1 x 8 Bit GPIO.MIO:
1 x SMBus.
1 x LPC (Via eSPI-to-LPC bridge), or 1 x eSPI (Only support 20MHz) (Build option).
1 x I2C.Ethernet:
1 x 10BASE-TE/100BASE-TX/1000BASE-T/2500BASE-T (Compatible Gigabit, above 70°C Tc, the recommended speed is 1G).
- Expansion
-
3 x PCIe x1 (Gen3) (8.0 GT/s).
- Other Features
-
BIOS:
AMI uEFI BIOS, 256 Mbit SPI Flash ROM.Watchdog Timer:
H/W Reset, 1sec. ~ 65535sec. and 1sec./step.H/W Status Monitor:
Monitoring System Temperature, Voltage and FAN Status with Auto Throttling Control.TPM:
TPM 2.0 (Optional).Audio:
Intel HD Audio integrated in SoC.
- Power
-
Requirement:
+9V to +19V.ACPI:
Single power ATX Support (S0, S3, S4, S5 ACPI 6.0 Compliant).Power Mode:
AT/ATX.
- Environmental
-
Operating Temperature:
0°C to 60°C (Standard with 0.2m/s air flow).
-40°C to 85°C (Conditional extended with 0.5m/s air flow).
Note: Above 70°C Tc, the recommended ethernet speed is 1G.Storage Temperature:
-40°C to 75°C.Operating Humidity:
40°C @ 95% Relative Humidity (Non-condensing).
- OS Support
-
Windows 10 IoT Enterprise (64-bit).
Linux.
- Dimensions
-
95 x 95 mm.
- Certification
-
CE / FCC (Class B).
COM Express Mini Size Type 10 Module with Intel Atom® E3800 series SoC or Celeron Processors (formerly Bay Trail)
- Intel Atom® SoC or Celeron® Processor.
- Up to 4 GB DDR3L 1333 MHz Memory.
- One DDI channel, one LVDS (optional eDP)
COM Express® Compact Size Type 6 Module with Intel Atom® E3800 series or Celeron® Processor SoC
- Intel Atom® SoC or Celeron® Processor.
- Up to 8 GB DDR3L 1333 MHz Memory.
- Single/dual channel 18/24-bit LVDS from eDP (two lanes)
COM Express Compact Size Type 2 Module with Intel® Atom™ E3800 series or Celeron® Processor SoC
- Intel Atom® SoC or Celeron® Processor.
- Up to 8 GB DDR3L 1333 MHz Memory.
- Single/dual channel 18/24-bit LVDS from eDP (two lanes)