COM Express Type 7 Module With Intel® Xeon D-1700 Series CPU.
- Intel® Xeon® D-1700 CPU.
- Up to 64GB DDR4 2666MHz.
- Supports 10GBASE-KR Ethernet.
- Rich I/O Interface (USB / SATA / LAN).
- Multiple Expansion (PCIe / SMBus / I2C / UART).
- -40 to 85°C Operating Temperature.
ADLINK’s Express-RLP COM Express Type 6 Basic size module is based on 13th Gen Intel® Core™ mobile processor (formerly codenamed Raptor Lake-P) and is the first COM Express utilizing Intel’s advanced hybrid architecture (with up to 6 Performance-cores and 8 Efficient-cores) offered with industrial-grade/real-time option to provide superior performance for edge IoT innovations across varied power ranges — at 15W/28W/45W TDP.
- Processor
-
3rd Gen Intel® Xeon® Scalable Processors D-1700 Family:
Intel® Xeon® D-1746TER (10 Cores / 15MB Cache / 2.0GHz / 67W).
Intel® Xeon® D-1735TR (8 Cores / 15MB Cache / 2.2GHz / 59W).
Intel® Xeon® D-1732TE (8 Cores / 15MB Cache / 1.9GHz / 52W).
Intel® Xeon® D-1715TER (4 Cores / 10MB Cache / 2.4GHz / 50W).
Intel® Xeon® D-1712TR (4 Cores / 10MB Cache / 2.0GHz / 40W).
- Chipset
-
SoC.
- Memory
-
Default 2 x 260-pin DDR4 2666 SO-DIMM dual channel mode up to 64GB.
3rd DIMM by request (SDPC mode by request to support DDR4 2933MHz).
- Storage
-
SATA:
2 x SATA 3.0 (Up to 6Gb/s).
- Graphics
-
GPU Feature Support:
Intel® Iris Xe or UHD Graphics Core Architecture, max. 96EUs, supporting 4 concurrent display combinations of DisplayPort/HDMI/LVDS/eDP/VGA and Display alternative mode through USB4/Thunderbolt4 outputs 1x 8K30 or 4x 4K60
Hardware video encode/decode, up to 8K60 HEVC
DirectX 12, OpenGL 4.6, Vulkan 1.2, Mesa 3D support
OneVPL
HDCP 2.3
Graphics Hardware Virtualization (SRIOV)Digital Display Interface: DDI 1/2/3 supporting DP 1.4a, HDMI 2.1, DVI
VGA: Supported by build option via DP-to-VGA IC (in place of DDI 3), max. resolution 1920×1200@60Hz
LVDS: Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC, max. resolution 1920×1200@60Hz in dual mode
eDP: Build option in place of LVDS, 4 lanes, eDP 1.4b
USB4: Max. 2x USB4 in place of DDI 1/2, supports DP 1.4a by DP alternative mode, Thunderbolt 4 capable (TBC)
Requires BIOS code modification by project basis, re-timer with PD on carrier
- I/O
-
Ethernet:
Supports up to 4 x 10GBASE-KR interfaces and max up to 4 x 10GbE MAC ports (Maximum bandwidth 40Gb by activating the 4 x 10GbE at the same time).
1 x Intel® I210AT (10/100/1000Mbps) (0 to 60°C / Default).
1 x Intel® I210IT (10/100/1000Mbps) (-40 to 85°C / Optional).
USB:
4 x USB 3.0.
4 x USB 2.0.DIO:
1 x 8-bit DIO (4 In / 4 Out).
- Expansion
-
(B1):
1 x PCIe x8 or 2 x PCIe x4 or 4x PCIe x2 (Gen 3).(B2):
1 x PCIe x8 or 2 x PCIe x4 or 4x PCIe x2 (Gen 3).(B3/B4):
1 x PCIe x16 or 2 x PCIe x8 or 4x PCIe x4 (Gen 4).Default:
1 x LPC.
1 x I2C.
1 x SMBus.
2 x UART (TX/RX).
- Other Features
-
BIOS:
Insyde SPI 512Mbit.
Watchdog Timer:
System Reset, Programmable via Software from 1 to 255 Seconds.Security:
Default TPM2.0 (fTPM by request).
- Power
-
Type:
12V, 5VSB, VCC_RTC (ATX mode).
12V, VCC_RTC (AT mode).
Consumption:
71.36W (Typical).
72.36W (Max).
- Environmental
-
Temperature:0 to 60°C (Default) / -40 to 85°C (Optional) Operating.
-40 to 85°C Storage.Humidity:5 to 90% RH Operating.
5 to 90% RH Storage.MTBF:277,731hrs @25°C; 144,676hrs @45°C; 81,589hrs @60°C; 55,811hrs @70°C; 37,526 @85°C Calculation model: Telcordia Issue 4
Environment: GB, GC – Ground Benign, Controlled.
- OS Support
-
Microsoft:Windows Server 2019 / 2022.Linux:Ubuntu 20.04 / CentOS 7.5.
- Dimensions
-
COM Express® Basic.
95mm (3.74″) x 125mm (4.9″).
- Certification
-
CE / FCC / RoHS.
COM Express Mini Size Type 10 Module with Intel Atom® E3800 series SoC or Celeron Processors (formerly Bay Trail)
- Intel Atom® SoC or Celeron® Processor.
- Up to 4 GB DDR3L 1333 MHz Memory.
- One DDI channel, one LVDS (optional eDP)
COM Express® Compact Size Type 6 Module with Intel Atom® E3800 series or Celeron® Processor SoC
- Intel Atom® SoC or Celeron® Processor.
- Up to 8 GB DDR3L 1333 MHz Memory.
- Single/dual channel 18/24-bit LVDS from eDP (two lanes)
COM Express Compact Size Type 2 Module with Intel® Atom™ E3800 series or Celeron® Processor SoC
- Intel Atom® SoC or Celeron® Processor.
- Up to 8 GB DDR3L 1333 MHz Memory.
- Single/dual channel 18/24-bit LVDS from eDP (two lanes)