COM Express Compact Size Type 6 Module With 11th Gen Intel Core and Celeron Processors
- 11th Gen Intel Core Series SoC.
- AI Inference (VNNI + Iris Xe).
- Up to 64GB DDR4 3200MHz.
- 2.5GbE Ethernet (Optional TSN).
- In-Band ECC Error Correction.
- -45°C to 85°C Extreme Temperature.
The ADLINK cExpress-TL is powered by the 11th Gen Intel® Core™ i7/i5/i3 and Celeron™ processors, and features PCI Express Gen 4 at 16 GT/s, which doubles the bandwidth of previous generations.
The ADLINK cExpress-TL supports 2.5GbE Ethernet, four 10Gb/s USB 3.2 ports, and is configurable at 15 to 28 watts.
This makes it an ideal choice for industries such as transport, medical, industrial automation, edge controllers, robotics, and multi-camera-based AI.
- Processor
-
11th Gen Intel® Core™ and Celeron® Processors (Mobile 10nm++ process) (Formerly “Tiger Lake UP3”):
Intel® Core™ i7-1185G7E (2.8 GHz to 4.4 GHz / 12MB Cache / 15-28W TDP / 4 Cores / Iris Xe).
Intel® Core™ i5-1145G7E (2.6 GHz to 4.1 GHz / 8MB Cache / 15-28W TDP / 4 Cores / Iris Xe).
Intel® Core™ i3-1115G4E (3.0 GHz to 3.9 GHz / 6MB Cache / 15-28W TDP / 2 Cores / UHD).
Intel® Celeron® 6305E (1.8 GHz / 4MB Cache / 15W TDP / 2 Cores / UHD).
Intel® Core™ i7-1185GRE (2.8 GHz to 4.4 GHz / 12MB Cache / 15-28W TDP / 4 Cores / Iris Xe).
Intel® Core™ i5-1145GRE (2.6 GHz to 4.1 GHz / 8MB Cache / 15-28W TDP / 4 Cores / Iris Xe).
Intel® Core™ i3-1115GRE (3.0 GHz to 3.9 GHz / 6MB Cache / 15-28W TDP / (2 Cores / UHD).
- Chipset
-
SoC.
- Memory
-
Dual channel DDR4 memory up to 3200 MT/s IBECC/non-ECC (BIOS selectable).
Up to 64GB (2 x 32GB) in two SODIMM sockets.
One SO-DIMM on top side and one SO-DIMM on bottom side.
Intel In-Band ECC (IBECC) (Provides ECC protection without additional ECC device) (i7-1185GRE, i5-1145GRE, i3-1115GRE support IBECC).
- Storage
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SATA:
2 x SATA 6Gb/s (SATA 0, 1).
- Graphics
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GPU Feature Support:
Intel® Gen12 Graphics Core Architecture, supporting 4 independent and simultaneous display combinations of DisplayPort/HDMI/LVDS, eDP or VGA outputs (4 x 4K60).
Hardware encode/transcode of HD content (Including HEVC).
DirectX 12 support.
OpenGL 4.5, 4.4/4.3 and ES 2.0 support.
OpenCL 2.1, 2.0/1.2 support.Digital Display Interface:
DDI1/2/3 supporting DisplayPort/HDMI/DVI.VGA:
Support by build option via DP-to-VGA IC (In place of DDI3) (Max resolution 1920 x 1200 @ 60Hz).LVDS:
Single/dual channel 18/24-bit LVDS via eDP-to-LVDS IC (Max resolution 1920 x 1200 @ 60Hz in dual mode).eDP:
Optional 4 lane support, in place of LVDS (Max resolution 4K @ 60Hz).
- I/O
-
USB:
4 x USB 3.2/2.0/1.1 (USB 0, 1, 2, 3) and 4 x USB 2.0/1.1 (USB 4, 5, 6, 7).Serial:
2 x UART ports with console redirection.GPIO:
4 x GPO and 4 x GPI from EC (GPI with interrupt).
- Expansion
-
5 x PCIe x1 (Gen3 / AB) Lanes 0/1/2/3 (Configurable to 4 x1, 2 x2, 1 x4, 2 x1 + 1 x2, 1 x2 + 2 x1) and Lane 4 (x1 only).
Note: PCIe switch build option available by project basis to offer more x1 lanes (Lanes 5, 6, 7).
1 x PCIe x4 (Gen4 / CD) Lanes 16-19 (Only x4).
LPC bus (Through an ESPI-to-LPC bridge IC).
SMBus (System).
I2C (User).
- Other Features
-
Embedded BIOS:
AMI UEFI with CMOS backup in 32 or 16MB (TBC) SPI BIOS with Intel® AMT 12.x support (Dual BIOS by build option).SEMA Board Controller Supports:
Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose I2C, watchdog timer, fan control and failsafe BIOS (Dual BIOS by build option).Debug Header:
30-pin multipurpose flat cable connector for use with DB-30 x86 debug module providing BIOS POST code LED, EC access, SPI BIOS flashing, power test points, debug LEDs.Audio:
Intel HD Audio integrated in SoC (Chipset).
On Express-BASE6 carrier (ALC886 standard support) (Audio Codec).Ethernet:
Intel® MAC/PHY.
Intel® i225 series (V/LM/IT versions) (LAN Controller).
TSN supported by IT versions only on Linux (By project basis).
2.5Gbe/1000/100/10 Mbit/s Ethernet connection (Interface).
GbE0_SDP available if TSN support enabled.TPM:
Infineon (Chipset).
TPM 2.0 (SPI based / build option).
- Power
-
Standard Input:
ATX (12V±5% / 5Vsb ±5%) or AT (12V±5%).Wide Input:
ATX (8.5-20 V / 5Vsb ±5%) or AT (8.5-20V).Management:
ACPI 5.0 compliant, Smart Battery support.Power States:
C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5).ECO mode:
Support deep S5 mode for power saving.
- Environmental
-
Operating Temperature:
0°C to 60°C (Standard).
-45°C to 85°C (Optional Extreme Rugged on selected SKUs).Storage Temperature:
-20°C to 80°C (Standard).
-45°C to 85°C (Extreme Rugged).Humidity:
5-90% RH (Operating / non-condensing).
5-95% RH (Storage and operating with conformal coating).Shock and Vibration:
IEC 60068-2-64 and IEC-60068-2-27.
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D.HALT:
Thermal Stress, Vibration Stress, Thermal Shock and Combined Test.
- OS Support
-
Windows 10 IoT Enterprise (64-bit).
Yocto Linux (64-bit).
VxWorks (64-bit) (TBC).
Ubuntu (TBC).
- Dimensions
-
95 mm x 95 mm (Compact size).
Form Factor:
PICMG COM.0 Rev 3.0 Type 6.
- Certification
-
CE.
COM Express Mini Size Type 10 Module with Intel Atom® E3800 series SoC or Celeron Processors (formerly Bay Trail)
- Intel Atom® SoC or Celeron® Processor.
- Up to 4 GB DDR3L 1333 MHz Memory.
- One DDI channel, one LVDS (optional eDP)
COM Express® Compact Size Type 6 Module with Intel Atom® E3800 series or Celeron® Processor SoC
- Intel Atom® SoC or Celeron® Processor.
- Up to 8 GB DDR3L 1333 MHz Memory.
- Single/dual channel 18/24-bit LVDS from eDP (two lanes)
COM Express Compact Size Type 2 Module with Intel® Atom™ E3800 series or Celeron® Processor SoC
- Intel Atom® SoC or Celeron® Processor.
- Up to 8 GB DDR3L 1333 MHz Memory.
- Single/dual channel 18/24-bit LVDS from eDP (two lanes)