0

Image 1
Image 2
Image 3

Aetina AI Inference / DeviceEdge Jetson Platform (Orin NX 8GB)

SKU: AIB-MN32-1-A1
  • 70 TOPS of AI performance
  • 1 x 8-Lane MIPI Expansion Connector
  • M.2 B//M-Key (128GB built-in)
  • 12 to 24VDC Input Voltage
  • Operating Temperature -25°C ~ +80°C
  • Supports Out-Of-Band (OOB)
Datasheet
Drivers & Support
Specifications
Request a Quote

Overview:

Huge leap in AI performance enables AI inference in the smallest Jetson form factor
The NVIDIA Jetson Orin NX module offers up to 100 TOPS, 3 times more than the NVIDIA Jetson AGX Xavier™ module, and approximately 5 times the NVIDIA Jetson Xavier™ NX module; NVIDIA Jetson Orin Nano module offers up to 40 TOPS, 80 times the NVIDIA Jetson Nano™ module. In other words, NVIDIA Jetson Orin NX and Orin Nano module set new standard for mainstream and entry-level edge AI in the smallest Jetson form factor.

Comprehensive M.2 for internal and external expansion 
AIB-MO22/32 and AIB-MN32/42 are platforms with high expansion ability, built in 1x M.2 B-Key for LTE/5G, 1x M.2 E-Key for Wifi/BT and 1x M.2 M-Key for storage. To avoid insufficient data storage for edge computing, these platforms support external M.2 2242 NVMe with fast data transmission.

Wide input power and operating temperature for various embedded applications 
To meet various embedded applications, especially challenging environments in smart factory, smart city, and smart transportation, AIB-MO22/32 and AIB-MN32/42 support operating temperature ranging from -25°C to 80°C and wide input power from 12 to 24VDC.

£987.00 ex VAT

<1 Week Lead Time

  • View all our regulatory information

Drivers, Documentation & Support

  • Documentation
  • Drivers
  • Need Help?
  • Talk to a Solution Specialist We're here to make sure you get your right fit solution.

Specifications

  • System
  • Processor(s)

  • 6-core Arm® Cortex-A78AE v8.2 64-bit 1.5MB L2 + 4MB L3.
  • Chipset

  • SOM.
  • Graphics / Display
  • Display Ports

  • 1 x HDMI 2.0 Type A.
  • Graphics Chipset

  • 1024 Core NVIDIA Ampere, with 32 Tensor Cores.
  • Memory
  • Memory Type

  • 8GB 128-bit LPDDR5 102.4 GB/s.
  • Number of Slots

  • N/A (on-board memory).
  • Clock Speed

  • 102.4 GB/s.
  • Max Capacity

  • 8GB.
  • I/O
  • Ports

  • 5 x GPIO

    1 x SPI

    1 x I2S

    3 x I2C

    1 x UART

    1 x UART (Debug Only)

    1 x RS-232

    1 x CAN (Isolation; support CAN FD)

    1 x RS-422/485 (2-in1)

    1 x microSIM Card Slot
  • Storage
  • Storage Type

  • 1 x M.2 M-Key 2242 (NVMe 128GB built-in).
  • RAID Support

  • N/A.
  • Expansion
  • Slots

  • 1 x M.2 B-Key 3042/3052 (LTE/4G/5G).
    1 x M.2 E-Key 2230 (WiFi/BT).
    1 x M.2 M-Key 2242 (NVMe 128GB built-in).
  • Power
  • Input Voltage Range

  • DC-in 12 to 24 VDC.
  • Connector Type

  • 4-Pin DC Jack.
  • Other Power Features

  • Idle: 7.3 W.
    Full Loading: 39 W.
  • Environmental
  • Temperature

  • Operating Temp.: -25°C ~ +80°C (-13°F ~ +176°F).
    Storage Temp.: -40°C ~ +85°C (-40°F ~ +185°F).
  • Shock

  • 10 G, IEC 60068-2-27, half sine, 11 ms duration.
  • Vibration

  • 1 Grms, IEC 60068-2-64, random, 5 ~ 500 Hz, 1 hr/axis.
  • IP Rating

  • N/A.
  • Mechanical
  • Dimensions

  • (W) 120 x (D) 100 x (H) 57.54 mm.
  • Weight

  • 0.195 kg (0.43 lb) with fansink.
  • Mounting

  • 4 x 3.2mm holes.
  • Other
  • Additional Features

  • 1 x Recovery / 1 x Reset Button.
  • OS Support

  • Linux (supports Jetpack 5.0 and above).
  • Certification

  • CE / FCC Class A / UKCA.

Need a Custom Solution?

Get in touch with our technical specialists to discuss your specific requirements and see if we can offer a solution.

Scroll to Top
Phone Envelope X-twitter Linkedin Instagram Youtube