COM-HPC Server Type Size D Module With Intel® Xeon® D-2700 CPU
- Intel® Xeon® D-2700 CPU.
- Up to 512GB DDR4 Support.
- 8 x 10G or 4 x 25G Ethernet.
- 32 PCIe (Gen 4) / 16 PCIe (Gen 3) Lanes.
- Intel® AVX-512 VNNI & DL Boost.
- 12V Voltage Input.
ADLINK’s COM-HPC-sIDH COM-HPC Server Type Size D module is based on the Intel® Xeon® D-2700 processor and features integrated high-speed Ethernet for up to 8x 10G or 4x 25G combined with 32 PCIe Gen4 lanes for instantaneous responsiveness and performance.
- Datasheet(s)
- User Manual
- Driver(s)
COM-HPC-sIDH Driver(s)
- Processor
-
Xeon® D-2796TE (2.0/3.1GHz 30MB 118W (20C, eTEMP)
Xeon® D-2775TE (2.0/3.1GHz 25MB 100W (16C, eTEMP)
Xeon® D-2752TER (1.8/2.8GHz 20MB 77W (12C, eTEMP)
Xeon® D-2733NT (2.1/3.2GHz 15MB 80W (8C, QAT)
Xeon® D-2712T (1.9/3.0GHz 15MB 65W (4C)
- Chipset
- Memory
-
Four DIMM sockets:
Up to 256GB (4 x 64GB) DDR4 RDIMM memory (Up to 3200MT/s).
Up to 512GB (4 x 128GB) DDR4 LRDIMM memory (TBC).
- Storage
-
eMMC 5.1 (Build option / TBC).
2 x SATA (SATA 0 / 1) (Build option in place of PCIe_BMC) (TBC).
- Graphics
- I/O
-
4 x USB 3.0/2.0/1.1 (USB 0 / 1 / 2 / 3).
2 x UART ports with console redirection.
12 x GPIO (GPI with interrupt) (TBC)
- Expansion
-
48 PCIe Lanes:
8 PCIe lanes 0-7 (J1): configurable to x8, x4, x2.
8 PCIe lanes 8-15 (J1): configurable to x8, x4, x2.
16 PCIe lanes 16-31 (J2): configurable to x16, x8, x4.
16 PCIe lanes 32-47 (J2): configurable to x16, x8, x4.
- Other Features
-
BIOS:
AMI UEFI with CMOS backup in 32MB SPI BIOS.Security:
Infineon Chipset.
TPM 2.0 (SPI based).Cache:
Xeon® D-2796TE (30MB).
Xeon® D-2775TE (25MB).
Xeon® D-2752TER (20MB).
Xeon® D-2733NT / D-2712T (15MB).Form Factor:
PICMG COM-HPC: Rev 1.0 Server Type.
- Power
-
Standard Input:
AT (12V±5%).Management:
ACPI 5.0 compliant.Power States:
TBC.
- Environmental
-
Operating Temperature (Standard):
0°C to 60°C.Storage Temperature (Standard):
-20°C to 80°C.Operating Temperature (Extreme Rugged):
-40°C to 85°C.Storage Temperature (Extreme Rugged):
-40°C to 85°C (Build option / Selected SKUs / TBC).
Humidity:
5-90% RH (Operating / non-condensing).
5-95% RH (Storage and operating with conformal coating).Shock & Vibration:
IEC 60068-2-64 and IEC-60068-2-27.
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D (TBC).HALT:
Thermal Stress, Vibration Stress, Thermal Shock and Combined Test.
- OS Support
-
Windows 10 IoT Enterprise LTSC, Windows Server 20H1
Yocto project based Linux 64-bit, VxWorks (TBC)
- Dimensions
-
Size D (160 mm x 160 mm).
- Certification