ADLINK’s COM-HPC-sIDH Ice Lake D COM-HPC Server Size D Module
- Intel® Xeon® D-2700 CPU.
- Up to 512GB DDR4 Support.
- 8 x 10G or 4 x 25G Ethernet.
- 32 PCIe (Gen 4) / 16 PCIe (Gen 3) Lanes.
- Intel® AVX-512 VNNI & DL Boost.
- 12V Voltage Input.
ADLINK’s COM-HPC-sIDH COM-HPC Server Type Size D module, featuring the Intel® Xeon® D-2700 processor, integrates high-speed Ethernet for up to 8x 10G or 4x 25G, alongside 32 PCIe Gen4 lanes, ensuring rapid responsiveness and high performance. Equipped with Intel® TCC, Deep Learning Boost (VNNI), and AVX-512 technologies for accelerated AI performance, plus Time Sensitive Networking (TSN) support, it enables precise control for real-time workloads across networked devices.
Designed for rugged AI applications with Intel® Ice Lake-D, this ADLINK COM empowers system integrators to explore IoT innovations across various domains, including unmanned aerial vehicles, autonomous driving, robotic surgery, rugged HPC servers, 5G base stations, automatic drilling, ship management, and more.
- Datasheet(s)
- User Manual
- Driver(s)
COM-HPC-sIDH Driver(s)
- Processor
-
Xeon® D-2796TE (2.0/3.1GHz 30MB 118W (20C, eTEMP)
Xeon® D-2775TE (2.0/3.1GHz 25MB 100W (16C, eTEMP)
Xeon® D-2752TER (1.8/2.8GHz 20MB 77W (12C, eTEMP)
Xeon® D-2733NT (2.1/3.2GHz 15MB 80W (8C, QAT)
Xeon® D-2712T (1.9/3.0GHz 15MB 65W (4C)
- Chipset
-
SoC
- Memory
-
Four DIMM sockets:
Up to 256GB (4 x 64GB) DDR4 RDIMM memory (Up to 3200MT/s).
Up to 512GB (4 x 128GB) DDR4 LRDIMM memory (TBC).
- Storage
-
eMMC 5.1 (Build option / TBC).
2 x SATA (SATA 0 / 1) (Build option in place of PCIe_BMC) (TBC).
- Graphics
- I/O
-
4 x USB 3.0/2.0/1.1 (USB 0 / 1 / 2 / 3).
2 x UART ports with console redirection.
12 x GPIO (GPI with interrupt) (TBC)
- Expansion
-
48 PCIe Lanes:
8 PCIe lanes 0-7 (J1): configurable to x8, x4, x2.
8 PCIe lanes 8-15 (J1): configurable to x8, x4, x2.
16 PCIe lanes 16-31 (J2): configurable to x16, x8, x4.
16 PCIe lanes 32-47 (J2): configurable to x16, x8, x4.
- Other Features
-
BIOS:
AMI UEFI with CMOS backup in 32MB SPI BIOS.Security:
Infineon Chipset.
TPM 2.0 (SPI based).Cache:
Xeon® D-2796TE (30MB).
Xeon® D-2775TE (25MB).
Xeon® D-2752TER (20MB).
Xeon® D-2733NT / D-2712T (15MB).Form Factor:
PICMG COM-HPC: Rev 1.0 Server Type.
- Power
-
Standard Input:
AT (12V±5%).Management:
ACPI 5.0 compliant.Power States:
TBC.
- Environmental
-
Operating Temperature (Standard):
0°C to 60°C.Storage Temperature (Standard):
-20°C to 80°C.Operating Temperature (Extreme Rugged):
-40°C to 85°C.Storage Temperature (Extreme Rugged):
-40°C to 85°C (Build option / Selected SKUs / TBC).
Humidity:
5-90% RH (Operating / non-condensing).
5-95% RH (Storage and operating with conformal coating).Shock & Vibration:
IEC 60068-2-64 and IEC-60068-2-27.
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D (TBC).HALT:
Thermal Stress, Vibration Stress, Thermal Shock and Combined Test.
- OS Support
-
Windows 10 IoT Enterprise LTSC, Windows Server 20H1
Yocto project based Linux 64-bit, VxWorks (TBC)
- Dimensions
-
Size D (160 mm x 160 mm).
- Certification
-
CE.
COM Express Type 6 Compact Module With 13th/12th Gen Raptor Lake U / Alder Lake U CPU.
- 13th/12th Gen Intel® CPU.
- Up to 64GB DDR4 3200MHz.
- Up to 12 Lanes PCI Express.
COM Express Compact Size Type 6 Module With AMD Ryzen™ Embedded V2000 APU.
- AMD Ryzen™ V2000 APU.
- Up to 64GB DDR4 Memory.
- Up to 4 x 4K Display (DP / eDP).
COM Express Rev. 3.1 Basic Size Type 7 Module with AMD Ryzen™ Embedded V3000
- AMD Embedded Ryzen V3000 CPU.
- Up to 64GB DDR5 4800 MT/s.
- 2.5G & 10G Ethernet Supported.
