Client Type COM-HPC Size C Module With 13th Gen Intel® Core™ Desktop CPU
- 13th Gen Raptor Lake-S CPU.
- Up to 24 Cores & 32 Threads.
- Up to 128GB DDR5 4000MT/s.
- Intel® AVX2 VNNI & Intel® DL Boost.
- Gen5 PCIe Expansion.
- 0°C to 60°C Operating Temperature.
ADLINK’s COM-HPC-cRLS COM-HPC Client Type Size C module is based on 13th Gen Intel® Core™ desktop processor. It features Intel’s advanced hybrid architecture (with up to 8 P-cores and 16 E-cores) along with 16 PCIe Gen5 that provide superior performance with fewer lanes than its predecessors, allowing for simplified designs and reduced time to market to drive various AIoT deployments.
- Datasheet(s)
- User Manual
- Driver(s)
- Processor
-
13th Gen Intel® Core™ Processors (formerly Raptor Lake-S) Processor Cores/Threads Cache TDP:
i9-13900E 8P+16E/32T 36MB 65W 32EU
i7-13700E 8P+8E/24T 30MB 65W 32EU
i5-13500E 6P+8E/20T 24MB 65W 32EU
i3-13100E 4P/8T 12MB 65W 24EUNote:
1. Lower TDP 35W SKUs and specific 125W SKUs are supported by project basis.
2. ECC and TCC are supported by pairing with R680E PCH.
- Chipset
-
Contact us for more information.
- Memory
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Up to 128GB (4 x 32GB) DDR5 SODIMM memory.
Max. 4000MT/s at four sockets (Two on top / Two at the bottom).
- Storage
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2 x SATA (SATA 0/1).
- Graphics
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GPU Feature Support:
Intel UHD Graphics 770 driven by Xe architecture, supporting multiple independent and simultaneous display combinations of DisplayPort/HDMI, eDP outputs (4 x 4K60).
Hardware encode/transcode of HD content (Including HEVC).
DirectX 12 support.
OpenGL 4.6 support.Display Interface:
DDI 0/1/2 supporting DisplayPort/HDMI/DVI.
DP1.4a and HDMI2.0b.eDP:
4 lane support, eDP 1.4b.
- I/O
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USB:
4 x USB 3.2/2.0/1.1 (USB 0/1/2/3).
4 x USB 2.0/1.1 (USB 4/5/6/7).Serial:
2 x UART ports with console redirection.GPIO:
12 x GPIO (GPI with interrupt / TBC).
- Expansion
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1 x PCIe Gen5 x16 at 16-31 and 1 PCIe Gen4 x4 at 8-11.
6 x PCIe Gen3 x1 at 0-5 (x4, x2, x1).More lanes with R680E/Q670E (all x4, x2, x1):
1 PCIe Gen4 x4 at 12-15.
1 PCIe Gen4 x4 at 32-35.
1 PCIe Gen4 x4 at 36-39.Note:
PCIe lanes 0-5, USB 3.0, SATA, NBASE-T and PCIe_BMC source from The available total raw bandwidth is equivalent to PCIe x16 Gen3 HSIO.
SMBus, 2x I2C, 1x GP_SPI, 1x Boot_SPI and eSPI.
- Other Features
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TPM:
Chipset (Infineon).
TPM 2.0 (SPI based).
- Power
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Standard Input:
ATX (TBC) (12V±5% / 5Vsb ±5%) or AT (12V±5%).Management:
ACPI 5.0 compliant.Power States:
TBC.ECO Mode:
TBC.
- Environmental
-
Operating Temperature:
Standard (0°C to 60°C).Storage Temperature:
-20°C to 80°C.Humidity:
5-90% RH operating (Non-condensing).
5-95% RH storage and operating with conformal coating.Shock & Vibration:
IEC 60068-2-64 and IEC-60068-2-27.
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D (TBC).HALT:
Thermal Stress, Vibration Stress, Thermal Shock and Combined Test.
- OS Support
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Windows 10 IoT Enterprise LTSC
Yocto project-based Linux 64-bit
- Dimensions
-
Size C (160 x 120 mm).
- Certification
-
CE.
Client Type COM-HPC Size C Module With 13th Gen Intel® Core™ Desktop CPU
- 13th Gen Raptor Lake-S CPU.
- Up to 24 Cores & 32 Threads.
- Up to 128GB DDR5 4000MT/s.
COM-HPC Server Type Size E Module with Ampere Altra SoC
- Ampere® Altra® Series CPU.
- Up to 768GB DDR4 3200MT/s.
- CCIX Capable.
ADLINK’s COM-HPC-sIDH Ice Lake D COM-HPC Server Size D Module
- Intel® Xeon® D-2700 CPU.
- Up to 512GB DDR4 Support.
- 8 x 10G or 4 x 25G Ethernet.
